Hanwha Chip Shooter | SMT Process Composition
From: Author:Hanwha Chip Shooter Publish time:2019-08-19 17:21 Clicks:16
Hanwha Chip Shooter | SMT Process Composition
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Surface Mounting Technology (SMT) was born in the 1960s. Surface Mount Technology (SMT) is a new generation of electronic assembly technology developed by hybrid integrated circuit technology. It features component surface mount technology and reflow soldering technology, and becomes a new generation assembly technology in electronic product manufacturing. . The wide application of SMT has promoted the miniaturization and multi-functionality of electronic products, providing conditions for mass production and low defect rate production.
First, solder paste printer
Its function is to print solder paste or patch glue on the pads of the PCB to prepare the soldering of the components. The equipment used is a screen printing machine (screen printer) at the forefront of the SMT line.
Second, placement
Its role is to accurately mount surface-mount components to a fixed location on the PCB. The equipment used is a placement machine located behind the screen printing machine in the SMT line.
Third, reflow oven soldering
Its function is to melt the solder paste and firmly bond the surface-mount components to the PCB. The equipment used is a reflow oven located behind the placement machine in the SMT.
Fourth, testing
Its role is to test the quality and assembly quality of the assembled PCB. The equipment used is a magnifying glass, microscope, online tester (ICT), flying probe tester, automatic optical inspection (AOI), X-RAY inspection system, functional tester, etc. The position can be configured in a suitable place on the production line according to the needs of the inspection.
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