With leads on 0.050 inch centers, the small outline integrated circuit (SOIC or SO) is basically a shrink package, which is used to the storage larger integrated circuits that is not able to be housed in SOT packages. Normally, SOICs are used to cover multiple SOTs.

Normally, the two sides of SOIC have leads that are known as gull-wing lead. The lead of SOICs is easy to be damaged, so the operator needs to handle SOICs carefully.

Usually, there two body widths of SOICs, 150 mils 300 mils. The body width is 150 mil if the lead quantity is within 16. 300 mil widths are used for more than 16 leads.

• Plastic Leaded Chip Carriers (PLCC):

As the cheaper version of the ceramic chip carrier, The leads of PLCC provide the compliance needed to withstand the solder joint stress to avoid the solder joint cracking.

For moisture absorption, PLCCs with large die-to-package ratios may be vulnerable to package cracking. whereupon, we should handle them in a proper method.

• Small Outline J Packages (SOJ):

Like the PLCC, the SOJ packages have led with J-bend, but the leads of the SOJ packages only on two sides.

What is more, SOJ packages are the combination of SOIC and PLCC, which has the handling advantages of the PLCC and the size efficiency of SOIC. Commonly, SOJs, are used in high-density DRAMSs.

• Fine Pitch SMD Packages (QFP, SQFP):

SMD packages have a plentiful number of leads with fine pitch, which is usually called a fine pitch package.

Please have a look, there are two examples of the fine pitch package: Quad flat pack (QFP) and shrink quad flat pack (SQFP). Fine pitch packages with thinner leads always require a thinner land pattern design.

• Ball Grid Array (BGA) SMD Components:

Ball Grid Array (BGA) is an array package like pin grid array, but their difference is that the PGA does not have the leads. BGAs have many types, and ceramic and plastic BGA is the main type.

BGA components

We usually name the ceramic BGAs as Ceramic Ball Grid Array and Ceramic Column Grid Array, and the plastic BGAs are commonly called PBGA.

Besides, tape BGA (TBGA) is also a kind of BGA. 1.0, 1.27, and 1.5 mm (40,50, and 60 mil pitch) are the standard ball pitch.

Normally, the body size of BGAs is from 7 to 50 mm, and its pins number can from 16 to 2400. But, the pin number of BGA varies from 200 to 500.

BGA has the strong ability of self-alignment during the soldering even if they are shifted by 50% when being mounted.

Comparing with PBGAs and CBGAs, CCGA and TBGA do not good at self align. This is why BGAs always have a higher yield.

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