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SMT PCBA defective: FPC Board Maintenance Requirements

6.11.6 FPC Board Maintenance Requirements

6.11.6.1 Welding temperature: According to the Reference Standard for Welding Temperature of Various Types of Components, the temperature of the heat gun should be between 260℃ and 280℃, and the temperature of the heating table should be between 180 ℃ and 200℃

6.11.6.2 Maintenance requirements: FPC board is easy to break due to its thin material. Deformation, we must pay attention to take gently in the maintenance process, maintenance to control the temperature, can not blow too long, FPC board is easy to blow paste. During maintenance, upper and lower heating can be selected, and also optional hot air gun heating. When the maintenance row is inserted, the electric iron can be added with tin, and the solder paste can be repaired with tweezers.

6.11.6.3 Precautions for FPC board maintenance: FPC board should not have discoloration or scorch, no sundries such as flux and cleaning agent can be removed in the arranging and inserting, and no shifting of components in and around the maintenance area. False welding. Even tin and other undesirable phenomena.

6.11.7 Appearance Check;

6.11.7.1 PCB and FPC board should be clean, no visible flux, solder and other foreign matter. Various oxides and other foreign matters generated during welding should not stick to the pins or the surface of components.

6.11.7.2. Clean the flux around the component with a cleaning agent. Note: When cleaning, do not clean in the direction of switch, row plug, RF head, MIC and other components, so as not to cause poor function.

6.11.7.3 The repaired boards shall be fully inspected for appearance and size, and the board photos of BGA chip for appearance maintenance shall be inspected by X-ray.

6.11.7.4 During visual inspection, focus on checking the maintenance area and its surroundings and components on the back for false welding, tin connection, displacement, material leakage, wrong material and floating.

6.11.8 Maintenance precautions:

6.11.8.1 Appearance Board after maintenance, components that cannot be visually inspected shall be inspected by X-ray for solder joints after maintenance.

 

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文章From:http://www.smt33.com//te_news_media/2021-09-03/31564.chtml